We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for BGA rework equipment.
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BGA rework equipment Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

BGA rework equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. ビオラ Fukushima//Electronic Components and Semiconductors
  2. ケイ・オール Tokyo//Manufacturing and processing contract
  3. レシップ電子 Gifu//Electronic Components and Semiconductors
  4. 4 グロース Kanagawa//Electronic Components and Semiconductors
  5. 5 ピーダブルビー Shiga//Industrial Electrical Equipment 草津事業所
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BGA rework equipment Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. "BGA Rework / BGA Reballing" *Available from just one unit! ビオラ
  2. [Exchange/Installation/Removal] High-quality BGA rework ケイ・オール
  3. BGA, CSP implementation, rework レシップ電子
  4. 4 BGA rework グロース
  5. 4 BGA Rework [Printed Circuit Board] シライ電子工業 P板開発サービス統括部

BGA rework equipment Product List

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"BGA Rework / BGA Reballing" *Available from just one unit!

"BGA Rework / BGA Reballing" *Available from just one unit!

Over 50,000 rework achievements for BGA with a pitch of 0.35 to 1.27mm! Even for just one piece, you can trust us with circuit boards that have underfill applied!

Our company performs "BGA rework and reballing" using IPC-recommended IR rework equipment (7 units owned). We have a track record of reworking over 100,000 BGA components with pitches ranging from 0.35 to 1.27mm, as well as reballing over 50,000 BGA components with ball diameters from Φ0.2 to 0.76mm. We can also accommodate copper core balls. We can handle requests starting from just one piece, and we are capable of working on circuit boards with underfill applied, as well as replacing QFN and connector components. We can also address components that are difficult to replace. Please feel free to consult with us. 【Features】 ■ BGA and QFN Rework - Over 100,000 BGA rework achievements with pitches from 0.35 to 1.27mm - Achievements with 1,300 special QFN components - Capable of handling difficult-to-replace components - Analysis of soldering conditions using X-ray observation equipment with CT functionality ■ BGA Reballing - Over 50,000 reballing achievements for BGA components with ball diameters from Φ0.2 to 0.76mm - Capable of handling components with underfill applied - Can manage the entire process from BGA removal to reballing to rework *For more details, please refer to the PDF document or feel free to contact us.

  • Company：ビオラ
  • Price：Less than 10,000 yen
  • Soldering Equipment
  • Dedicated IC
  • Prototype Services

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BGA Rework [Printed Circuit Board]

BGA Rework [Printed Circuit Board]

We will accommodate from one piece!

"BGA rework" requires high-precision equipment and advanced technology, and our company has established that environment. ★ We can handle from one piece, one point. ★ Please consult us before giving up. ★ We will assist in solving your company's problems. * Please rest assured that we conduct X-ray inspections for all units. * For more details, please refer to the PDF materials or feel free to contact us.

  • Visual Inspection Equipment
  • Printed Circuit Board
  • Other electronic parts

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Technical Document "Underfill BGA Rework Technology"

Technical Document "Underfill BGA Rework Technology"

Can also cooperate in criminal investigations!

We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.

  • others

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[Exchange/Installation/Removal] High-quality BGA rework

[Exchange/Installation/Removal] High-quality BGA rework

BGA exchange, installation, and removal services available! We have received voices of joy.

"BGA rework" refers to the process of partially heating BGA devices on completed circuit boards using specialized rework machines, tailored to specific needs. At K-All, we can handle both eutectic and lead-free soldering, and we have received positive feedback from many customers. We can perform work tailored to customer requests and the condition and symptoms of the circuit board. 【Features】 ■ Stable cleaning operations for circuit boards and removed devices ■ Cream solder supply (printing and coating) technology ■ Support for 0402 chips and micro-sized packages ■ Compatibility with large and multilayer circuit boards ■ Ability to accommodate a wide range of pitches, including special pitches *For more details, please refer to the PDF materials or feel free to contact us.

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  • Contract manufacturing

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BGA Rework

BGA Rework

We can accommodate large substrates and thick substrates.

BGA rework refers to the process of partially heating BGA on completed circuit boards to remove and install them. Our company has newly introduced a BGA rework device that can handle large circuit boards (Max 500×600) and thick boards (Max 7mm) due to its high thermal capacity, in addition to being lead-free. For reballing work when "wanting to reuse components," we have solder balls available in both eutectic and lead-free options, compatible with pitches ranging from 1.27mm to 0.4mm. We can also accommodate BGA jumper work.

  • Other semiconductors
  • Printed Circuit Board
  • Prototype Services

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BGA, CSP implementation, rework

BGA, CSP implementation, rework

Stable quality through process management

With over 15 years of experience, we handle printing inspection, full ball inspection, and X-ray inspection. Additionally, we replace components using rework machines without causing any damage. For more details, please contact us or download the catalog.

  • Technical and Reference Books

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BGA rework

BGA rework

If it's about BGA rework, leave it to us! We will introduce the work process.

Our company performs "BGA Rework and Reballing" using IPC-recommended IR rework equipment (7 units). "BGA Rework" refers to the process of removing a BGA mounted on a circuit board and installing a new BGA. The process involves removing the BGA from the circuit board, cleaning the solder left on the pads (lands) of the circuit board, applying flux or solder paste, placing the BGA, heating it with an IR heater, and joining the solder balls. Finally, the soldering condition is checked using an X-ray inspection machine. If you need BGA rework, please leave it to us. We have a track record of reworking over 100,000 units of BGA with pitches ranging from 0.3 to 1.27 mm. We are here to assist in rescuing discarded circuit boards. 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder left on the pads (lands) of the circuit board ■ Placement: Apply flux or solder paste, then place the BGA ■ Heating: Heat with an IR heater to join the solder ■ X-ray Inspection: Check the soldering condition with an X-ray inspection machine *For more details, please refer to the PDF document or feel free to contact us.

  • Company：ビオラ
  • Price：Less than 10,000 yen
  • Circuit board design and manufacturing
  • Contract manufacturing

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BGA rework

BGA rework

By utilizing area heaters/spot heaters, avoid damage with minimal heating!

Our company is capable of providing careful BGA rework and jumper modifications with a short turnaround time. We have a team of experienced and skilled technicians, allowing us to perform reworking safely and swiftly based on their expertise and advanced equipment. Moreover, it is not an exaggeration to say that the quality and delivery time of jumper modifications can vary significantly depending on the skill level of the technician in charge. Just like with BGA rework, our skilled craftsmen will handle each wiring with care and speed. 【BGA Rework Points】 ■ Thorough pre-verification through temperature profiling ■ Use of area heaters/spot heaters to avoid damage with minimal heating ■ Complete prevention of pad delamination *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing

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